Project Plan
Kothandaraman Kannadasan Lv3

A project plan defines the multiple stages of the process. How will it be started, and we should finish it. It is derived from the items below:

Here’s a detailed breakdown of each stage in the project plan, including its purpose and what it entails:

1. Gerber Out

Purpose: Generate and send the Gerber files to the manufacturer for PCB fabrication.

Process:

  • Design Review: Ensure the PCB design is finalized and reviewed for errors.
  • Gerber File Generation: Export the PCB layout into Gerber files using EDA software.
  • File Verification: Validate the Gerber files using a Gerber viewer.
  • Send to Manufacturer: Submit the Gerber files to the chosen PCB fabrication house.

2. PCBA (Printed Circuit Board Assembly)

Purpose: Assemble the PCB with components.

Process:

  • Component Sourcing: Order all required components.
  • Stencil Preparation: Prepare a stencil for solder paste application.
  • Solder Paste Application: Apply solder paste to the PCB.
  • Component Placement: Place components on the PCB using pick-and-place machines.
  • Reflow Soldering: Pass the PCB through a reflow oven to solder components.
  • Inspection: Inspect the assembled PCBs for defects (automated optical inspection or manual).

3. BBU (Bring-Up and Basic Unit Testing)

Purpose: Power on the PCB and perform initial functionality tests.

Process:

  • Power On: Safely power on the PCB for the first time.
  • Basic Testing: Perform basic tests to check if the board is operational (e.g., voltage checks, basic functionality tests).
  • Initial Debugging: Identify and fix any immediate issues.

4. Check Point

Purpose: Review progress and ensure everything is on track.

Process:

  • Team Meeting: Conduct a meeting with the project team to review the status.
  • Review Milestones: Check if the project is meeting its milestones.
  • Issue Resolution: Address any issues or roadblocks encountered so far.

5. SI (Signal Integrity Testing)

Purpose: Ensure signal integrity of high-speed signals on the PCB.

Process:

  • Test Setup: Set up signal integrity testing equipment.
  • Perform Tests: Conduct tests to measure signal quality (e.g., eye diagrams, crosstalk).
  • Analyze Results: Analyze test results and identify any signal integrity issues.
  • Mitigate Issues: Implement design changes if necessary to address signal integrity problems.

6. DVT (Design Verification Testing)

Purpose: Verify that the design meets all specifications and requirements.

Process:

  • Test Planning: Develop a comprehensive test plan covering all functional and performance aspects.
  • Execute Tests: Perform the planned tests (e.g., functional tests, thermal tests, stress tests).
  • Document Results: Record test results and compare them with the expected outcomes.
  • Review: Conduct a review meeting to discuss the test results and any deviations.

7. RRC (Reliability and Regulatory Compliance)

Purpose: Ensure the product is reliable and meets regulatory standards.

Process:

  • Reliability Testing: Perform tests to assess the product’s reliability (e.g., burn-in testing, environmental testing).
  • Regulatory Testing: Conduct tests to ensure compliance with regulatory standards (e.g., FCC, CE).
  • Certification: Obtain necessary certifications for the product.

8. Debug

Purpose: Identify and resolve any remaining issues.

Process:

  • Issue Identification: Identify any functional or performance issues.
  • Root Cause Analysis: Perform detailed analysis to find the root causes of issues.
  • Implement Fixes: Implement solutions to fix the identified issues.
  • Retest: Retest the fixed issues to ensure they are resolved.

9. TSP/PE Transfer (Test Service Provider/Production Engineering Transfer)

Purpose: Transfer the project to production engineering and/or test service provider for mass production.

Process:

  • Documentation: Prepare detailed documentation for production (e.g., assembly instructions, test procedures).
  • Training: Train the production and test teams on the new product.
  • Pilot Run: Conduct a pilot run to validate the production process.
  • Feedback: Collect feedback from the pilot run and make necessary adjustments.

10. PCQ

11. FPR and C4 Pass (Final Product Review and Customer Closure)

Purpose: Final review of the product and customer acceptance.

Process:

  • Final Review: Conduct a thorough review of the final product.
  • Customer Testing: Provide the product to the customer for their testing and approval.
  • Feedback: Collect and address any feedback from the customer.
  • Acceptance: Obtain formal acceptance from the customer, completing the project.

This sequence ensures a structured and thorough approach to developing and bringing a product to market, addressing design, assembly, testing, compliance, and final review stages.